Appeal 2007-0942
Application 10/666,742
17. A method for thinning a semiconductor substrate, comprising:
forming a support structure on an active surface of the semiconductor
substrate;
removing material from a back side of the semiconductor substrate to form a
thinned semiconductor substrate; and
transporting the thinned semiconductor substrate for further processing.
The Examiner relies upon the following references in the rejection of
the appealed claims:
Leedy US 5,869,354 Feb. 9, 1999
Grigg US 6,562,661 B2 May 13, 2003
Appellants’ claimed invention is directed to a method for thinning a
semiconductor substrate comprising forming a support structure on the
active surface of the substrate. Material is then removed from the back side
of the substrate.
Appealed claims 17-20 stand rejected under 35 U.S.C. § 102(b) as
being anticipated by Leedy. Claims 21, 23-27, and 30-34 stand rejected
under 35 U.S.C. § 103(a) as being unpatentable over Leedy in view of
Grigg.
We have thoroughly reviewed each of Appellants’ arguments for
patentability. However, we find that the Examiner’s rejections are well
founded and supported by the prior art evidence relied upon. Accordingly,
we will sustain the Examiner’s rejections for essentially those reasons
expressed in the Answer.
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