Appeal 20072907
Application 10644791
The examiner has also rejected the claims relying on the Gallo patent and the
Fujii and Yamaguchi publications.
SCOPE AND CONTENT OF THE PRIOR ART
The Gallo patent
The Gallo patent is directed to flame-retardant molding composition.
It explains that epoxy resins are widely used for such compositions but that
antimony oxides and bromine (a halogen) used in such compositions present
safety concerns. Phosphorous containing compounds are noted to have
undesirable properties such as a high moisture absorption rate.18 The Gallo
patent proposes a composition substantially free of halogen, phosphorus, and
antimony that includes at least an epoxy resin and a transition metal oxide of
a Group VIA element.19
The Saito publication
Saito discloses an epoxy resin molding compound that is fire
retardant.20 Although bromine and antimony oxide were commonly used in
such compositions as fire retardants, Saito prefers to avoid halogens and
15 Masanobu Fujii et al., Epoxy resin composition for sealing semiconductor
and semiconductor device using the composition, JP H11-269347 A (pub'd 5
October 1999) (Fujii).
16 Hiroyuki Saito et al., Epoxy resin molding material for sealing electronic
component and electronic part item sealed therewith, JP H10-212396 A
(pub'd 11 August 1998) (Saito).
17 Yoshio Yamaguchi and Hiroko Yamamoto, Resin composition for sealing
semiconductor and semiconductor device using the same, JP H11-100492 A
(pub'd 13 April 1999).
18 Gallo patent 1:5-35.
19 Gallo patent 1:47-65.
20 Saito ¶0001.
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