Appeal No. 96-2821
Application 08/015,007
insulator 12. The shape of the insulator 12 necessarily
corresponds to the shape of the substrate 10. (2:40-52.)
16. The rings 14 & 16 are fixed directly onto adjacent
substrates. The insulator 12 bonds the two rings together.
(2:42-59.) The rings are thin, glass-sealing, metal alloys.
(3:10-15.) The insulator 12 is preferably glass. (3:5-6.) The
TCE of the rings should roughly match the TCEs of the
substrates 10 and the glass insulator 12. (2:60-64.)
17. Iversen teaches that "[a]t high frequencies, e.g.,
microwave, the thickness, dielectric constant, loss tangent etc.
of insulator 12 and the geometry, e.g., round, square,
rectangular etc. of substrate 10 and rings 14, 16 would be
optimized to minimize power losses and to optimize the VSWR
(Voltage Standing Wave Ratio) at the operating frequencies."
(3:49-55, emphasis added.)
18. Iversen expressly teaches a thickness range for the
insulator 12 of 0.003 inches (in.) to 0.030 in. (3:15-18.) This
works out to be 0.0762 millimeters (mm) (=0.003 in. x
25.4 mm/in.) to 0.762 mm (=0.030 in. x 25.4 mm/in.).
19. The Matsumoto kokai publication lists a claim for a
semiconductor package with a glass insulator having a dielectric
constant of 8.0 or less. (p. 2.) Matsumoto notes that glass
insulators in conventional semiconductor packages typically have
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