Ex parte WATANABE et al. - Page 2




          Appeal No. 95-1987                                                          
          Application 08/076,475                                                      



          Before KIMLIN, JOHN D. SMITH and PAK, Administrative Patent                 
          Judges.                                                                     
          JOHN D. SMITH, Administrative Patent Judge.                                 


                                 DECISION ON APPEAL                                   
                    This is an appeal pursuant to 35 U.S.C. § 134 from                
          the examiner's final rejection of claims 1, 3-7 and 29-34.                  
                    Claims 1 and 4 are representative and are reproduced              
          below:                                                                      
                    1.  A method for vulcanizing and molding a rubber                 
          compound comprising the steps of:                                           
                    providing a mold formed of a single material, said                
          mold cooperating with a pair of electrode plates holding said               
          mold therebetween,                                                          
                    providing a rubber compound having a dielectric loss              
          factor regulated to a value of more than 0.20,                              
                    supplying said rubber compound into said mold,                    
                    pressurizing said mold and performing dielectric                  
          heating under frequency in a range of 10 to 100 MHZ for vulca-              
          nizing said rubber compound concurrently with molding thereof               
          to a rubber article having a desired volume, wherein   said                 
          heating is directly applied to said mold via said electrode                 
          plates.                                                                     
                    4.  The method for molding a rubber compound as set               
          forth in claim 1, wherein said rubber compound includes at                  


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