Ex parte BURGIE et al. - Page 6




          Appeal No. 95-3422                                                           
          Application 07/891,132                                                       
          the art would have wanted to solve them.  Accordingly, we                    
          reverse the examiner’s rejections of Claims 1-9 and 12-21.                   
               Claims 10 and 11 present a slightly different issue                     
          because Richerson describes a silicon nitride electrical                     
          insulating layer or jacket integrally bonded to a silicon                    
          carbide/silicon nitride heating element (Richerson, col. 2, l.               
          49-68).  The examiner argues that it would have been prima                   
          facie obvious in view of Richerson’s teaching to apply a high                
          temperature resistant silicon nitride electrical insulating                  
          layer or jacket to the                                                       
          heating element of Levin’s reactor.  On consideration of the                 
          prior art teaching as a whole, we find the examiner’s argument               
          untenable.                                                                   
               First, Richerson describes a silicon nitride electrical                 
          insulating layer or jacket hot-pressed to a silicon carbide/                 
          silicon nitride heating element.  Richerson does not indicate                
          that silicon nitride electrical insulating layers or jackets                 
          may be applied to, or are useful as electrical insulators for,               
          heating elements generally.  See Richerson’s Example 1, col.                 
          5, l. 35-51:                                                                 
               A graphite mold set-up was assembled with the exception                 
               of the top plate.  An 81.0 gram quantity of the silicon                 
               nitride powder was spread in the mold, followed by 21.7                 
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