Ex parte DAS et al. - Page 7




          Appeal No. 95-3936                                                          
          Application 08/135,324                                                      
          that:                                                                       
                    After exposure, the wafer is maintained in an inert               
                    medium to ensure that the latent image remains                    
                    stable.                                                           
          Lines 10 through 15 of page 5 inform us that:                               
                    In one embodiment, the inert medium can be nitrogen               
                    gas. In another embodiment, the wafer can be                      
                    maintained in water. In another embodiment, the                   
                    wafer can be maintained in nitrogen during the                    
                    exposure of the wafer. Finally, the nitrogen or                   
                    other inert atmospheric conditions can also be                    
                    employed to regenerate the surface of the latent                  
                    image after it has been subjected to the normal                   
                    clean room ambient.                                               
                    At page 10, line 5 through page 11, line 9,                       
          appellants discuss several embodiments of their invention.                  
          Specifically, after a series of conventional, prior art                     
          processing steps but before post exposure baking appellants                 
          disclose that:                                                              
                    the water cassette used to hold the                               
                    wafers during lithography process 100                             
                    could be modified to provide an inert                             
                    gas ambient for the wafers after                                  
                    exposure. (page 5, lines 5 through 8)                             
          It is also disclosed that:                                                  
                    In the currently preferred embodiment                             
                    the wafer ambient is the inert gas                                
                    nitrogen. (page 5, lines 10 and 11)                               
          As an alternative, the wafers may be stored in water rather                 
          than an inert gas (page 5, lines 14 and 15).  Or, the wafer                 
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