Ex parte CHEN et al. - Page 5




          Appeal No. 97-3530                                                          
          Application No. 08/418,122                                                  


          the “barrier layer,” as claimed, again, Armstrong fails to                  
          teach or suggest the claimed deposit of aluminum on a barrier               
          layer, said deposit beginning during the temperature raising                
          step.                                                                       
               While a barrier layer may have been well known in the                  
          art, as apparently contended by the examiner in referring to                
          admitted prior art, we find no reason, and certainly no reason              
          clearly articulated by the examiner, as to why the skilled                  
          artisan would have combined the statements of admitted prior                
          art in the instant specification with the Armstrong disclosure              
          in such a manner as to arrive at the instant claimed invention              
          wherein aluminum is begun to be deposited on a barrier layer                
          during a temperature raising step.  Wolf, applied as a                      
          standard text to show that there is inherent heating during an              
          aluminum sputter deposition process, is of no help in this                  
          regard.  The claimed temperature raising step entails raising               
          the temperature from below approximately 350 degrees                        
          Centigrade to a value between approximately 400 and 500                     
          degrees Centigrade.  The sputter deposition first step in                   
          Armstrong is done at a temperature below 200 degrees                        
          Centigrade (column 3, lines 12-13 of Armstrong).  Thus, we                  
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