Ex parte KOYAMA et al. - Page 2




          Appeal No. 95-3455                                                          
          Application 07/945,902                                                      


               The claimed invention is directed to a method for forming              
          a non-volatile memory having a floating gate electrode.                     
          Floating gate electrodes are useful in re-writable, non-                    
          volatile memory devices such as the so-called EPROM's                       
          (electrically programmable read only memory devices).  The                  
          floating gate electrode is so-named because an insulating                   
          tunnel oxide is sandwiched between the gate electrode and the               
          underlying silicon substrate.  Thus, charges flowing in the                 
          underlying substrate through the tunnel oxide into the                      
          floating gate electrode are prevented from flowing back by the              
          tunnel oxide insulation.                                                    
               Claim 6 is reproduced below for a more facile                          
          understanding of appellants' invention.                                     
               Claim 6. A method for forming a non-volatile memory                    
               having a floating gate electrode comprising the                        
               steps of:                                                              
                                                                                     
               (a) forming a tunnel oxide layer used                                  
               for writing information on a silicon substrate,                        
                                                                                     
               (b) forming a polysilicon layer on                                     
               the tunnel oxide layer,                                                
                                                                                     
               (c) forming a tungsten                                                 
               silicide layer over the polysilicon layer with a                       
               chemical vapor deposition using WF  gas reduced with                   
                                                 6                                    
               a SiH Cl  gas at a temperature in the range of 500 to                  
                    2 2                                                               
               600EC, and the fluorine content in the resulting                       
                                          2                                           





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