Ex parte HAWKINS et al. - Page 10




          Appeal No. 96-3998                                                          
          Application No. 08/344,397                                                  


          is suggested by the teachings of the applied prior art.                     
          Instead, the Examiner makes the broad general assertion at                  
          page 5 of the Answer:                                                       
                         Ricoh teaches a high voltage MOSFET                          
                         with a drift region and dual thickness                       
                         gate insulator under a stepped gate, as                      
                         here claimed.  It would clearly have been                    
                         obvious to use Ricoh’s high voltage MOSFET                   
                         structure in the admittedly known “thermal                   
                         ink jet printhead” ICs.                                      
          The Examiner, however, never provides any factual support for               
          the apparent contention that the MOSFET structure of Ricoh                  
          corresponds to the claimed MOS transistor structure of claim                
          16.                                                                         
               Appellants, for their part, argue (Brief, page 9) that                 
          there is no suggestion in any of the references to make the                 
          proposed combination and even if such combination could be                  
          made, such combination would lack the features as claimed.  In              
          particular, Appellants point to the lack of teaching in any of              
          the references of the limitation recited in subparagraph f) of              
          independent claim 16 as follows:                                            
                         a source contact contacting said source                      
                         region, said source contact spaced from                      
                         said drain contact, extending laterally                      
                         towards said drain contact no further                        
                         than said polysilicon field plate portion;                   
                                          10                                          





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