Appeal No. 97-0557
Application 08/371,040
from the Examiner's final rejection of claims 13 through 17,2
all the pending claims in the case.
The disclosed invention pertains to an architecture
for distributing input signals from a bondpad area to an
interior portion of an integrated circuit device, such as a
plurality of memory blocks. Instead of placing input buffers
at the periphery of the integrated circuit device, the claimed
invention distributes the unbuffered input signal lines to the
input buffers located in the interior portion of the
integrated circuit adjacent the circuit blocks that use the
input signals.
Representative claim 13 is reproduced as follows:
13. An input architecture for supplying a plurality of
signals to a plurality of circuit blocks located in an
interior portion of an integrated circuit device, comprising:
a bondpad area;
a plurality of input buffers each located adjacent to and
connected to one of said plurality of circuit blocks;
a plurality of unbuffered signal lines, each of said
plurality of unbuffered signal lines connected between said
bondpad area and all of said plurality of input buffers.
2An amendment after the final rejection was filed on
April 23, 1996 [paper no. 30] and entered in the record.
-2-
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