Ex parte IKEDA et al. - Page 3




               Appeal No. 1996-1372                                                                                                
               Application No. 08/003,659                                                                                          


                       According to Shibuya, polyolefins (e.g., polypropylene) are inexpensive, have excellent molding             

               properties, toughness, resistance to water, organic solvents and chemicals, and low specific viscosity              

               but have insufficient heat resistance; whereas, polyphenylene ether resins have excellent heat resistance           

               but unsatisfactory molding properties and solvent resistance (page 2, lines 10-19).  Therefore, blends of           

               polyolefins and polyethylene ether resins have been proposed which compensate for the respective                    

               disadvantages while retaining the respective advantages inherent in each (page 2, lines 20-47).  Shibuya            

               discloses a resin blend which  “exhibits well-balanced mechanical strength properties, solvent                      

               resistance, and molding properties at relatively high levels” (page 2, lines 49-50) obtained “by                    

               compounding a hydrogenated block copolymer of an alkenyl aromatic compound and a conjugated                         

               diene having properties of specific ranges with a combination of a polyphenylene ether resin and a                  

               crystalline polyolefin” (page 2, lines 53-57). Shibuya’s blended resin composition comprises (a) from               

               20 to 80%, most preferably from 33 to 55%, by weight of a polyolefin, preferably a crystalline                      

               polypropylene resin, (b) from 20 to 80%, most preferably 35 to 53%, by weight of a polyphenylene                    

               ether resin, (c) from 4 to 50%, most preferably from 10 to 20%, by weight of a hydrogenated alkenyl                 

               aromatic compound/conjugated diene block copolymer and, optionally, (d) from 0.05 to 30 parts, most                 

               preferably from 2 to 15 parts, by weight of the total amount of the components (a), (b) and (c), a                  

               diamide compound of formula                                                                                         
                       R -NHCO-R -CONH-R11          10           12          (D-1),                                                                


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