Ex parte LYONS et al. - Page 4




             Appeal No. 1997-0552                                                                               
             Application No. 08/267,490                                                                         


                                                   OPINION                                                      

                   In reaching our decision in this appeal, we have given careful consideration to              
             appellants’ specification and claims, to the applied prior art references, and to the              
             respective positions articulated by appellants and the examiner.  As a consequence of our          
             review, we make the determinations which follow.                                                   
                   While we agree with the examiner that Lappington provides a strong motivation to             
             incorporate semiconductor programming functionality into the manufacturing or assembly             
             environment, the examiner has not addressed the language of the claims to which the                
             rejection is addressed.  Appellants argue that the claimed invention is directed to a              
             different invention than is Lappington.                                                            
                   Appellants repeatedly argue that the claimed invention is directed to the automatic          
             programming, testing, marking and mounting of a semiconductor in a manufacturing area.             
             (See brief at page 5, 8, 9 and 10.)  We agree with appellants.  The examiner has not               
             addressed the automatic nature of the claimed invention.  While we find the limitation             
             containing the term “automatic” only in the last step involving the mounting, the claim            
             recites that the semiconductor is conveyed between the steps and that the programming              
             head is "receiving and retaining" the semiconductor.  In light of the specification and the        
             combination of conveying of the semiconductor with the receipt and retention of the                
             semiconductor, the claimed process and apparatus are automatic rather than manual.  We             


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