Ex parte SUMMERFELT et al. - Page 8




          Appeal No. 1997-2026                                                        
          Application 08/317,108                                                      


          claims are not argued separately, either by Appellants or the               
          Examiner, the rejection of claims 2 to 4, 10 to 15, and 28 to               
          33 under the same grounds is also not sustained.                            
                          Rejection under 35 U.S.C. § 103                             
               Claim 24 is rejected as being obvious over Uchino and                  
          Miyasaka under 35 U.S.C. § 103.  The Examiner’s position is                 
          that Uchino shows BaTi0  which has a high dielectric constant               
                                 3                                                    
          and also shows BaTi0  doped with 0.15 atom% of La which has a               
                              3                                                       
          low resistance.  The Examiner further asserts that this BaTi03              
          and the doped BaTi0  of Uchino can be obviously used in the                 
                             3                                                        
          capacitor forming process of Miyasaka [answer, pages 3 to 5].               
               Appellants argue [brief, pages 5 to 7] that Uchino and                 
          Miyasaka are not properly combinable because there is no                    
          motivation to combine.  Appellants argue [id. 6 and 7] that                 
          “[t]he electrode structure in Uchino’s patent (sic,                         
          publication) is a stacked structure of interleaved electrodes               
          and dielectrics laminated together [and] ... laminate                       
          structures ... use a completely different manufacturing                     
          technology.”                                                                




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