Appeal No. 1998-2046
Application No. 08/787,332
sidewall and said first conductive layer continuously
surrounds the sidewall of the second conductive layer;
an insulating layer formed on said first and second
conductive layers, said insulating layer having an upper
surface and a hole therethrough from the upper surface to a
surface of said second conductive layer; and
a third conductive layer formed on said insulating layer
in
direct contact with said second conductive layer through said
hole and spaced apart from said first conductive layer with
said
insulating layer therebetween; wherein,
a thickness of said insulating layer at a region
surrounding
said hole from the upper surface of the insulating layer to
the
surface of the second conductive layer is less than a
thickness of insulating material separating said first and
third conductive layers from each other.
The Examiner relies on the following references:
Rathbun et al. (Rathbun) 4,628,006 Dec. 9, 1986
Kwansnick et al. (Kwansnick) 5,233,181 Aug. 3,
1993
Appellants’ Admitted Prior Art (APA) Figures 18-29
Claims 1 through 6, 12 and 13 stand rejected under 35
U.S.C.
§ 112, first paragraph, as containing subject matter not
supported by the specification.
3
Page: Previous 1 2 3 4 5 6 7 8 9 10 11 12 13 Next
Last modified: November 3, 2007