Ex parte SUPPELSA et al. - Page 2




               Appeal No. 1998-3045                                                                                               
               Application 08/612,693                                                                                             

               Appellants’ own disclosed prior art from page 1, line 10 to page 2, line 15, and lines                             
               17-24 and 29-31 of page 3.                                                                                         
                                                  The Rejection on Appeal                                                         

                      Claims 1-15 stand finally rejected under 35 U.S.C. § 103 as being unpatentable                              
               over the disclosed prior art in view of either Tanaka or Neumann.                                                  
                                                        The Invention                                                             

                      The claimed invention is directed to a substrate having a circuit pattern on the top                        
               side of the substrate, an electrically adjustable trim pad on the bottom side of the substrate                     
               and a plurality of surface mount connections on the bottom side.  Representative claims 1                          
               and 11 are reproduced below:                                                                                       
                      1.  A C5 substrate having an electrically adjustable trim pad on a side, comprising:                        
                              a substrate having a top side and a bottom side;                                                    
                              a circuit pattern on the top side;                                                                  
                              a trim pad on the bottom side; and                                                                  
                              a plurality of surface mount connections on the bottom side, each comprising                        
               a C5 solder bump, at least one of the plurality of surface mount connections electrically                          
               connected to the circuit pattern on the top side.                                                                  
                      11.  A module having an electrically adjustable trim pad on a bottom side,                                  
               comprising:                                                                                                        
                              a substrate having a top side and a bottom side;                                                    
                              a circuit pattern on the top side;                                                                  



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