Ex parte KREISEDER et al. - Page 6




          Appeal No. 1999-0953                                                        
          Application No. 08/576,618                                                  

          1, which require two different thicknesses.  Moreover, since                
          the inner section 28 of Murphy is expressly stated to be                    
          thinner than the peripheral outer section 27, sections 28 and               
          27 of Murphy have precisely the opposite thickness                          
          relationship as is called for in claim 1.  Accordingly, we                  
          cannot accept the examiner’s first rationale, namely, that                  
          claim 1 does not structurally define over Murphy.                           


               As to the examiner’s alternative theory of obviousness,                
          Laauwe pertains to an applicator for a viscous product                      
          comprising a valve head having a thin flat wafer 4                          
          stationarily supported by a set of spokes 5, and an                         
          elastically deflectable diaphragm 7 having a central opening 8              
          and an annular hinge in the form of a pleat P or reduced wall               
          thickness R connecting the diaphragm to a depending flange 9.               
          Laauwe describes the operation of the valve head as follows:                
               . . . [The] hinging action [of P or R] results in                      
               the diaphragm extending from the annular hinging                       
               portion to the central opening 8, moving with a                        
               swinging action when the product to be dispensed is                    
               pressurized by squeezing of the bottle, resulting in                   
               the diaphragm’s opening having a slight swinging or                    
               wiping action with respect to the valve seat formed                    
               by the wafer 4.                                                        


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