Ex parte FUTAKUCHI - Page 11




          Appeal No. 2000-0806                                                        
          Application No. 09/016,398                                                  


          determine the scope of the claim.  "[T]he name of the game is               
          the claim."  In re Hiniker Co., 150 F.3d 1362, 1369, 47 USPQ2d              
          1523, 1529 (Fed. Cir. 1998).                                                


                    Appellant's claim 14 recites a semiconductor                      
          integrated circuit device comprising a semiconductor chip                   
          having a plurality of connection pads, each connected on a                  
          first surface of a carrier base to a corresponding conductor,               
          each conductor connected to a corresponding spherical-shaped                
          external connection terminal on a second, opposite side of the              
          carrier base, a first insulating adhesive layer adhering the                
          carrier base to the semiconductor chip, a second insulating                 
          adhesive layer adhering a reinforcement base to the                         
          semiconductor chip, the carrier base and reinforcement base                 
          forming a "sandwich" with the insulating layers and                         
          semiconductor chip between them, and wherein the carrier base               
          and reinforcement base have substantially the same size as the              
          semiconductor chip.                                                         


                    We agree with the Examiner that Dordi teaches, as                 


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