Ex parte FUTAKUCHI - Page 14




          Appeal No. 2000-0806                                                        
          Application No. 09/016,398                                                  


          n.14 (Fed. Cir. 1992), citing In re Gordon, 733 F.2d 900, 902,              
          221 USPQ 1125, 1127 (Fed. Cir. 1984).  "Obviousness may not be              
          established using hindsight or in view of the teachings or                  
          suggestions of the inventor."  Para-Ordnance, 73 F.3d at 1087,              
          37 USPQ2d at 1239, citing W. L. Gore & Assocs., 721 F.2d at                 
          1551, 1553, 220 USPQ at 311, 312-13.                                        


                    Appellant's claim 1 recites a semiconductor chip                  
          having a plurality of connection pads; a carrier base having a              
          first surface to which the chip is mounted; a plurality of                  
          conductors, each connected to a corresponding connection pad,               
          penetrating through the carrier base to the opposite, second                
          surface of the carrier base; a plurality of spherical-shaped                
          external connection terminals disposed on the second surface                
          of the carrier base, each electrically connected to a                       
          corresponding conductor; a sealing resin layer surrounding a                
          periphery of the chip; and a reinforcement base, which along                
          with the carrier base sandwiches the semiconductor chip and                 
          its associated resin layer, having the same coefficient of                  
          thermal expansion as the carrier base, such                                 


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