Ex parte BALDI - Page 3


              Appeal No. 1997-3532                                                                                          
              Application 08/411,385                                                                                        

              bottom of a contact hole (claim 11); forming a layer of tungsten (claim 1), which can be a derivative         
              thereof (claim 11), that coats all of the surfaces of the contact hole without filling the hole (claim 1), in 
              other words, conformally coats all of the surfaces without filling the hole (claim 11); and forming a layer   
              of aluminum or a derivative thereof over the tungsten layer under planarizing conditions, filling the         
              contact hole (claim 1), in other words, planarizing and void filling, completely filling the hole (claim 11). 
              While the use of the transitional term “comprising” permits the presence of other layers between the          
              titanium layer and the tungsten layer,6 the titanium or derivative layer and the tungsten or derivative layer 
              must first be in the contact hole, without filing the hole, and then the hole is filled with aluminum or      
              derivative in a planarizing manner.  Each of claims 1 and 11 requires that the tungsten or derivative layer   
              is applied by chemical vapor deposition and the aluminum or derivative layer is applied by sputter            
              deposition under planarizing conditions.                                                                      
                     We find that Yamaha discloses with respect to FIG. 2, that intermediate conduction path 27             
              comprises, in sequence, lower barrier film 28, a metal film 29 and upper barrier film 30, wherein the         
              metal layer can be an aluminum alloy and the lower and upper barrier layers can be titanium, titanium         
              silicide, tungsten, tungsten or tungsten silicide or a titanium-tungsten alloy, the layers being deposited by 
              ordinary sputtering, thus forming only a lower barrier layer and a non-planar metal film layer in a contact   
              hole (col. 3, lines 4-65).                                                                                    
                     The examiner points out that there are a number of differences between the above teachings of          
              Yamaha that involve each of the above noted layers and methods of forming the same required in the            
              claimed processes encompassed by claims 1 and 11 (answer, pages 4-5 and 9) and submits that each              
              of these differences represents a modification within the ordinary skill in this art as shown by the cited    
              prior art.                                                                                                    
                     We have carefully considered the examiner’s position but find no explanation therein with              
              respect to the applied prior art which establishes that, prima facie, one of ordinary skill in this art would 
              have found in the combined teachings of the applied prior art a suggestion to arrive at the sequence of       
                                                                                                                            
              6  See In re Baxter, 656 F.2d 679, 686-87, 210 USPQ 795, 802-03 (CCPA 1981) (“As long as one                  
              of the monomers in the reaction is propylene, any other monomer may be present, because the term              
              ‘comprises’ permits the inclusion of other steps, elements, or materials.”).                                  

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