Appeal No. 1998-1374
Application No. 08/466,562
examiner's refusal to allow claims 1 through 10 and 21 through
25, all the claims remaining in the instant application.
THE INVENTION
The appealed subject matter is directed to copper-based
sintering pastes for forming conductive vias and surface
patterns in or on ceramic substrates. The pastes are useful in
the semiconductor packaging art and control the grain size and
shrinkage concomitant with the use of copper pastes on ceramic
substrates. This problem has been exacerbated by the
continuing trend towards high circuit densities.
Independent claims 1 and 21 are believed to be adequately
representative of the appealed subject matter and are
reproduced below for a more facile understanding of
appellants' invention.
Claim 1. A copper-based sintering paste for forming
conductive vias and surface patterns in or on ceramic
substrates, said paste comprising:
powdered copper particles, powdered copper
aluminate particles and organic materials,
said copper aluminate constituting up to
10% by weight of said paste.
Claim 21. A copper-based sintering
paste for forming conductive vias and surface patterns in
2
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