Appeal No. 1998-1374
Application No. 08/466,562
informative to reproduce here independent claims 11 and 26
from appellants' earlier filed application.
Claim 11. A multilayered ceramic package comprising:
a ceramic substrate; and a copper-based
sintering paste for forming conductive vias and
surface patterns in or on said ceramic substrate,
said paste comprising:
powdered copper
particles, powdered copper aluminate particles and
organic materials, said copper aluminate
constituting up to 10% by weight of the paste.
Claim 26. A multilayered ceramic package
comprising:
a glass-ceramic substrate; and a
copper-based sintering paste for forming conductive
vias and surface patterns in or on said glass-
ceramic substrate, said paste comprising, by volume
percent of inorganic solids:
90 volume
percent copper particles, 5-12 volume percent of
glass-ceramic particles, 0.3-1.5 volume percent of
copper aluminate particles, and organic materials.
Thus, by mere inspection, it is apparent that the claims here
on appeal are for the very same copper-based pastes claimed in
appellants' earlier filed application as part of the
"multilayered ceramic package" in independent claims 11 and 26
reproduced above.
THE REJECTION UNDER 35 U.S.C. § 112
The examiner has rejected appellants' claim 3 on the
grounds that the language in claim 3 that the copper aluminate
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