Ex parte MELTON et al. - Page 3




             Appeal No. 1998-3053                                                                                 
             Application 08/677,755                                                                               


                                               THE REJECTIONS                                                     
                    Claims 13-18 stand rejected as follows: under the                                             
             judicially created doctrine of obviousness-type double                                               
             patenting over                                                                                       


             claim 1 of Melton ‘453 in view of Tulman, and under 35 U.S.C.                                        
             § 103 as being unpatentable over Melton ‘341 in view of                                              
             Tulman.                                                                                              
                                                    OPINION                                                       
                    We reverse the aforementioned rejections.                                                     
                            Obviousness-type double patenting rejection                                           
                    Claim 1 of Melton ‘453 recites that the assembly is                                           
             heated to a temperature greater than the melting temperature                                         
             of a solder composition formed of first and second metal                                             
             constituents, but less than the melting temperature of each of                                       
             these constituents, such that the first and second metals                                            
             cooperate to form an interfacial liquid phase that wets a                                            
             metal plate composed of the first metal and a metal bump                                             
             composed of the second metal.                                                                        
                    Tulman discloses a solder composition which typically is                                      


                                                      -3-3                                                        





Page:  Previous  1  2  3  4  5  6  7  Next 

Last modified: November 3, 2007