Appeal No. 1998-3059
Application 08/554,288
ions. The appellants indicate that including magnesium in the
solution causes the copper coatings to be uniform and to have
good adhesion (specification, page 3). Claim 1 is
illustrative:
1. A process for the electroless deposition of a copper
coating on an iron or iron alloy surface by means of a
solution containing copper and hydrogen ions, comprising:
contacting the surface with a solution comprising 5 to 30 g/l
Cu and 0.2 to 5 g/l Mg.
THE REFERENCES
Schwartz 3,460,953 Aug. 12,
1969
Knaster et al. (Knaster) 4,563,216 Jan. 7,
1986
THE REJECTION
Claims 1-5 stand rejected under 35 U.S.C. § 103 as being
unpatentable over the combined teachings of Knaster and
Schwartz.
OPINION
We reverse the aforementioned rejection. We need to
address only claim 1, which is the sole independent claim.
Knaster discloses an electroless plating process using a
solution containing about 10 to about 30 g/l of cupric ions
2
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