Appeal No. 1999-0576
Application No. 08/576,634
board based on thermal design constraints including the thermal effect one component has
on another component.
Representative claim 1 is reproduced as follows:
1. A method for thermal driven placement in a programmed computer system, the
method comprising:
separately computing thermal response function data for each component in
a group of components for a plurality of locations on a placement surface; and
placing the group of components on the placement surface in a first
placement;
computing a thermal contribution from a second component on a first
component by finding a temperature value from the thermal response function data of the
second component corresponding to a location of the first component;
summing the temperature value from the thermal response function data of
the second component with a temperature value of the first component to compute a
calculated junction temperature of the first component; and
comparing the calculated junction temperature with a predefined junction
temperature to analyze whether the first placement satisfies a predefined thermal design
constraint.
The examiner relies on the following references:
DiGiacomo et al. (DiGiacomo) 4,630,219 Dec. 16, 1986
Phillips et al. (Phillips) 4,894,709 Jan. 16, 1990
G. Casselman et al. (Casselman), “A Thermal Model for Hybrid Circuits,” Hybrid Circuits,
No. 10, May 1986, pages 9-13.
2
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