Appeal No. 1999-1127
Application 08/689,164
said first insulting layer by mechanical bonding as a result
of thermal spraying;
whereby said selected regions provide interconnects
between conducting layers through direct metallurgical
bonding.
The Examiner relies on the following references:
Saito 4,525,383 Jun. 25, 1985
Sienski 5,200,580 Apr. 6, 1993
Claims 1 and 3-4 are rejected under 35 U.S.C. § 102(b) as
being anticipated by Saito. Claims 1-2 are rejected under 35
U.S.C. §102(b) as being anticipated by Saito. Claims 5-7 are
rejected under 35 U.S.C. § 103 as being unpatentable over
Saito. Claim 8 is rejected under 35 U.S.C. § 103 as being
unpatentable over Saito in view of Sienski.
Rather than reiterate all arguments of Appellants and the
Examiner, reference is made to the briefs and the answer for
the respective details thereof.2
2 Rather than attempt to reiterate the Examiner’s full
commentary with regard to the above-noted rejections and the
conflicting viewpoints advanced by the Examiner and Appellants
regarding the rejections, we make reference to the examiner’s
answer (Paper No. 14, mailed October 13, 1998), for the
reasoning in support of the rejections, and to Appellants’
brief (Paper No. 13, filed August 28, 1998), and Reply Brief
3
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