Appeal No. 1999-1127
Application 08/689,164
Claim 1, the sole independent claim at issue here,
recites an interconnect device comprising among other elements
a “first insulating layer adhering to said first conducting
layer by mechanical bonding as a result of thermal spraying”
and a “second conducting layer adhering to said first
insulating layer by mechanical bonding as a result of thermal
spraying” A review of the specification fails to find
disclosure of a definition of the phrase “mechanical bonding.”
Mechanical is defined as “relating to, produced by, or
dominated by physical forces.” Thus, the scope of claim 1 6
is limited to an interconnect device in which insulating and
conducting layers are adhered by bonding that relates to, is
produced by, or is dominated by physical forces.
Saito is directed to a manufacture of a multi-layer
circuit substrate. Bonding between alternating conducting and
insulating layers is discussed in col. 4, lines 9-21; col. 4,
line 56 to column 5, line 2. These sections describe the
6 See Webster’s II New College Dictionary.
6
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