Ex parte BREARLEY et al. - Page 4



            Appeal No. 1999-2403                                                                      
            Application 08/576,185                                                                    


            to satisfy the written description requirement of 35 U.S.C. §                             
            112, first paragraph.  In re Lukach, 442 F.2d 967, 969, 169 USPQ                          
            795, 796 (CCPA 1971).  The question is not whether an added word                          
            was the word used in the specification as filed, but whether                              
            there is support in the specification for the employment of the                           
            word in the claims, that is, whether the concept is present in                            
            the original disclosure.  See                                                             
            In re Anderson, 471 F.2d 1237, 1244, 176 USPQ 311, 336 (CCPA                              
            1973).                                                                                    
                  Following this guidance, it is readily apparent to us that                          
            appellants had an adequate basis within the original disclosure                           
            to have later claimed the subject matter of claims 18-21.                                 
                  Appellants’ prior art discussion at pages 1 and 2 of the                            
            specification as filed indicates that it was known in the art for                         
            implementing controlled collapse chip connection (C4)                                     
            semiconductor interconnection structures to have used a fixture                           
            including a so-called depositor within which solder had been                              
            placed subject to being reflowed.  This depositor permitted the                           
            fixture apparatus of the prior art to place solder balls on a                             
            structure to receive them.  It is thus apparent that upon the                             
            application of the proper reflow temperature the depositor                                
            released the solder within its cavities in order to form the                              

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