Appeal No. 2000-1835
Application No. 08/868,092 Page 2
appealed claims separately to the extent justified by appellants’
arguments in the brief. An understanding of the invention can be
derived from a reading of exemplary claim 13, which is reproduced
below.
13. A process for metallizing the walls of holes within a
printed circuit board substrate having metallic and non-metallic
regions, said process comprising the steps of treating the
printed circuit board substrate with a single aqueous acid
solution containing a hydroxyl ammonium reducing agent and an
amine polyelectrolyte, contacting the so treated surface with an
aqueous dispersion of carbonaceous particles to form a coating of
said dispersion over all surfaces of said substrate and
electroplating metal on said substrate from an electrolytic metal
plating solution.
The prior art references of record relied upon by the
examiner in rejecting the appealed claims are:
Growald et al. (Growald) 3,674,711 Jul. 04, 1972
Doty et al. (Doty) 3,962,497 Jun. 08, 1976
Hou et al. (Hou) 4,309,247 Jan. 05, 1982
Pendleton 5,015,339 May 14, 1991
Toro 5,143,592 Sep. 01, 1992
Florio et al. (Florio) 5,683,565 Nov. 04, 1997
(filed May 23, 1996)
Claims 13-16 and 20-23 stand rejected under 35 U.S.C. § 103
as being unpatentable over Pendleton in view of Doty, Growald and
Florio. Claims 17-19 stand rejected under 35 U.S.C. § 103 as
being unpatentable over Pendleton in view of Hou and Toro.
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