Appeal No. 2000-1835
Application No. 08/868,092 Page 4
Subsequently metal is electroplated on the substrate. See, for
example, the abstract and column 6, lines 25-58 of Pendleton.
Pendleton (column 6, lines 59-62) further discloses that the
method is particularly useful for electroplating nonconductive
portions of through hole walls of printed wiring boards.
Pendleton (column 7, lines 6-10 and the paragraph bridging
columns 9 and 10) teaches that water may be used in forming the
solution containing a polyelectrolyte and a reducing agent and
that water may be used as a liquid dispersing medium for the
carbon black dispersion; hence suggesting the claimed requirement
for an aqueous solution and an aqueous dispersion. Pendleton
describes hydroxylamine sulfate as a preferred acidic reducing
agent, cationic polyamine homopolymer resins as a preferred
polyelectrolyte and hydrochloric acid as a pH adjustor for use in
the treating solution. See column 9, lines 16-56 of Pendleton.
Moreover, we note that Pendleton (column 19, l6 line 68 through
column 20, line 26) teaches that less defects are obtained by
using their method.
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