Appeal No. 2001-0014 Page 2
Application No. 09/070,899
The appellant’s invention relates generally to hermetic
enclosures for opto-electronic devices and more specifically,
to hermetically packaged photodetector arrays which do not
require an hermetic optical fibre/guide feedthrough
(specification, p. 2). A rear light-entry planar
semiconductor photodiode array chip is processed to form the
active regions and patterned to define a set of contact areas
(specification, p. 3). Solder coatings cover and conform in
shape to corresponding underlying contacts. The photodiode
array chip is bonded face down onto a ceramic substrate to
provide electrical connection between the contacts on the chip
and metallization on the ceramic substrate as well as form the
seal for hermetic enclosure (specification, p. 4). Thus, the
individual photodiodes of the array may be optically coupled
with ends of individual optical fibers through the rear
surface of the chip.
Representative independent claim 6 is reproduced as
follows:
6. An opto-electronic device array assembly including a
semiconductor chip having a monolithic array of planar
construction semiconductor opto-electronic rear light
entry/exit devices, which chip is bonded with solder face
down upon a ceramic substrate so as to constitute an
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