Ex parte HSIAO - Page 1




               The opinion in support of the decision being entered                   
               today was not written for publication in a law                         
               journal and is not binding precedent of the Board.                     
                                                               Paper No. 12           


                      UNITED STATES PATENT AND TRADEMARK OFFICE                       
                                                                                     
                         BEFORE THE BOARD OF PATENT APPEALS                           
                                  AND INTERFERENCES                                   
                                                                                     
                              Ex parte YUNG-KUAN HSIAO                                
                                                                                     
                                Appeal No. 2001-0228                                  
                             Application No. 09/116,612                               
                                                                                     
                                      ON BRIEF                                        
                                                                                     
          Before KIMLIN, OWENS and JEFFREY T. SMITH, Administrative                   
          Patent Judges.                                                              
          KIMLIN, Administrative Patent Judge.                                        


                                 DECISION ON APPEAL                                   
               This is an appeal from the final rejection of claims 1-                
          15, all the claims in the present application.  Claim 1 is                  
          illustrative:                                                               
          1.   A method for forming a patterned composite stack layer                 
          within a microelectronics fabrication comprising:                           
               providing a substrate;                                                 
               forming over the substrate a blanket first silicon layer;              
                                         -1-                                          




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