Appeal No. 2001-2315
Application 09/145,106
packaged integrated circuit device. Upon a view of Biederman we
find that Biederman focuses on the use of plasma polymers in
semiconductors chip fabrication and is not at all concerned with
chip packaging or die and die carrier combinations. Verzaro
discloses only plasma polymerization of protective coatings on
plastic substrates. Again, Verzaro does not mention die and/or
die carriers or is concerned with the problem of chip packaging.
Therefore, we find that the Examiner has not shown that one of
ordinary skill in the art would have made the modification
proposed by the Examiner to the Yew reference.
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