Appeal No. 1999-2595
Application No. 08/927,106
as a diffusion barrier to prevent diffusion of nickel into the
yttrium-based copper oxide (YBCO) superconductor during subsequent
high temperature melt-processing (Brief, page 2). A copy of
illustrative independent claim 1 is attached as an Appendix to this
decision.
The examiner has relied upon the following references as
evidence of obviousness:
Woolf et al. (Woolf ‘389) 5,047,389 Sep. 10, 1991
Woolf et al. (Woolf ‘360) 5,164,360 Nov. 17, 1992
Ozaki et al. (Ozaki), “Preparation of Superconducting Y-Ba-Cu-O
Thin Films on Metallic Substrates,” Proc. of the Conference on the
Science and Technology of Thin Film Superconductors, pp. 363-370
(1989).
Boikov et al. (Boikov), “Epitaxial growth and properties of
YBa2Cu3O7-*/NdGaO3/YBa2Cu3O7-* trilayer structures,” Appl. Phys. Lett.,
59(20), pp. 2606-2608 (1991).
Han et al. (Han), “Metalorganic chemical vapor deposition route to
epitaxial neodymium gallate thin films,” Appl. Phys. Lett., 61(25),
pp. 3047-3049 (1992).
Claims 1, 19, 21 and 22 stand rejected under 35 U.S.C.
§ 103(a) as unpatentable over Ozaki in view of Woolf ‘389 and
Boikov, further in view of Han (Answer, page 3).1 Claims 3-6 stand
rejected under 35 U.S.C. § 103(a) as unpatentable over the
1The examiner has incorrectly stated the Boikov reference as
“Boivok et al.” on page 3 of the Answer, but correctly listed
this reference on page 4 of the Answer. Accordingly, this error
is deemed harmless.
2
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