The opinion in support of the decision being entered today was not written
for publication and is not binding precedent of the Board.
Paper No. 11
UNITED STATES PATENT AND TRADEMARK OFFICE
____________
BEFORE THE BOARD OF PATENT APPEALS
AND INTERFERENCES
____________
Ex parte CHWAN-YING LEE and TZUEN-HSI HUANG
____________
Appeal No. 1999-2739
Application No. 08/891,127
____________
ON BRIEF
____________
Before KIMLIN, WALTZ, and TIMM, Administrative Patent Judges.
WALTZ, Administrative Patent Judge.
DECISION ON APPEAL
This is a decision on an appeal under 35 U.S.C. § 134 from
the examiner’s final rejection of claims 1 through 10, 12
through 14, 16 through 21, and 25 through 28, which are the only
claims remaining in this application.1
According to appellants, the invention is directed to a
submicron interconnection using a nickel electroless process on
1Appellants’ amendment subsequent to the final rejection
has been entered (see the Amendment dated Oct. 16, 1998, Paper
No. 6, and the Advisory Action dated Oct. 28, 1998, Paper No.
7).
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