Appeal No. 2001-0953
Application No. 08/923,651
invention is an apparatus and method for automatically detecting
defects on silicon dyes on a silicon wafer. The apparatus
automatically detects defects by having an image acquisition
system and a computer connected to the image acquisition system.
The computer analyzes a random sample of silicon dies to
determine an average or standardized die image. The statistical
die model is compared to silicon dies on a silicon wafer to
determine if the silicon dies have surface defects. See page 5
of Appellants' specification.
Independent claim 1 present in the application is reproduced
as follows:
1. An apparatus for automatically detecting defects on silicon
dies on a silicon wafer comprising:
an image acquisition system; and
a computer connected to said image acquisition system
wherein said computer automatically aligns said silicon wafer,
automatically obtains an image of a plurality of silicon dies,
automatically calculates a statistical die model from a samples
[sic; sample] of silicon dies, and automatically compares said
statistical die model to a plurality of silicon die images to
determine if said silicon dies have surface defects; and if said
silicon dies have surface defects stores the location of said
silicon dies containing defects and the location of said surface
defects on the silicon wafer in memory.
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