Appeal No. 2001-0953
Application No. 08/923,651
silicon dies, automatically calculates a statistical
die model from a sample of silicon dies.
The Examiner relies on Tanaka for the teaching of the above
limitations. See pages 2 and 3 of the answer.
Appellants respond to the Examiner by pointing out that
Tanaka does not teach the limitation of automatically calculating
a statistical die model from a sample of silicon dies.
Appellants point out that Tanaka teaches at the top of column 4
that only one die is scanned and that this die must be a flawless
die and from this flawless die parameters are derived. See page
3 of the Appellants' reply brief.
Upon our review of Tanaka, we find that Tanaka teaches that
flawless wafer 1 is put on a moving mechanism 3. The CCD camera
5 scans the flawless wafer 1 and the image data are stored to the
frame memory 8. On the basis of these data, a set of fundamental
pattern vectors are generated. See column 4, lines 1-10. Upon
our complete review of Tanaka, we fail to find that Tanaka
teaches a computer that automatically obtains an image of a
plurality of silicon dies and automatically calculates a
statistical die model from a sample of silicon dies as recited in
Appellants' claims.
66
Page: Previous 1 2 3 4 5 6 7 8 Next
Last modified: November 3, 2007