Appeal No. 2001-1449 Page 2
Application No. 08/791,177
Representative claim 20 is reproduced as follows:
20. A method of assembling a semiconductor die device comprising:
providing a primary die exhibiting at least one electrical or operational
characteristic;
mounting at least one patch die on said primary die for altering said at
least one electrical or operational characteristic of said primary die; and
forming an electrical contact between said at least one patch die and said
primary die.
The examiner relies on the following references:
Takiar et al. (Takiar) 5,422,435 June 6, 1995
Tsubouchi JP 56-158467 Dec. 7, 1981
Claims 20-38 and 41 stand rejected under 35 U.S.C. § 103. As evidence of
obviousness the examiner offers Takiar in view of Tsubouchi.
Rather than repeat the arguments of appellants or the examiner, we make
reference to the briefs and the answer for the respective details thereof.
OPINION
We have carefully considered the subject matter on appeal, the rejection
advanced by the examiner and the evidence of obviousness relied upon by the
examiner as support for the rejection. We have, likewise, reviewed and taken into
consideration, in reaching our decision, the appellants’ arguments set forth in the briefs
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