Ex Parte MA et al - Page 6




              Appeal No. 2001-1449                                                               Page 6                
              Application No. 08/791,177                                                                               


              operational characteristic of the first die” [brief, page 15, bottom of page].  The quoted               
              portion of appellants’ argument is clearly unrelated to the actual recitation of claim 20.               
              Thus, appellants’ arguments are frequently directed to an invention which has not been                   
              claimed.  Appellants seem to be arguing the disclosed invention in which remediation is                  
              the key feature of the invention.  Note that remediation is specifically defined on page 7               
              of the specification but does not appear in representative claim 20.  For purposes of                    
              applying prior art against claim 1, no teaching of remediation is required.                              
                    The examiner has broadly interpreted the phrase “altering said at least one                        
              electrical or operational characteristic of said primary die” as being “altering an electrical           
              characteristic of said primary die.”  In other words, the examiner finds that a prior art                
              reference must only teach or suggest that an electrical characteristic of the primary die                
              is altered.  We agree that this is the correct interpretation of the phrase in claim 20 for              
              applying prior art against the claim.  Unfortunately, the examiner has not further                       
              specifically indicated how he interprets this phrase.  It does appear, however, that the                 
              examiner interprets an electrical characteristic of the primary die as being met by a                    
              voltage level at a bonding pad of the primary die.  It appears to be the position of the                 
              examiner that when signals are exchanged between the patch die and the primary die                       
              using a bonding pad of the primary die, the voltage levels of the bonding pad are                        
              altered to reflect this connection.  We agree with this finding of the examiner.  For                    
              example, if the connection point is an input/output port between the two dies, the                       








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