The opinion in support of the decision being entered
today was not written for publication and
is not binding precedent of the Board.
Paper No. 15
UNITED STATES PATENT AND TRADEMARK OFFICE
_____________
BEFORE THE BOARD OF PATENT APPEALS
AND INTERFERENCES
_____________
Ex parte SESHADRI VIKRAM and WILLIAM J. SCHAEFER
_____________
Appeal No. 2004-0133
Application No. 09/668,031
______________
ON BRIEF
_______________
Before KIMLIN, GARRIS and STAAB, Administrative Patent Judges.
KIMLIN, Administrative Patent Judge.
DECISION ON APPEAL
This is an appeal from the final rejection of claims 1-3,
5, 7-9, 11 and 12, all of the claims remaining in the present
application.
Claim 1 is illustrative:
1. A packaged integrated circuit comprising:
a die having first and second surfaces and a
multiplicity of die contacts arranged on the first
surface of the die;
a barrier layer deposited on the second surface of
the die;
Page: 1 2 3 4 5 6 7 8 9 10 Next
Last modified: November 3, 2007