Appeal No. 2004-0133
Application No. 09/668,031
combination wherein a die is flip-chip mounted to a substrate and
a heat sink is soldered to the metalized back surface of the die
is a unique combination that is in no way suggested by any
reasonable combination of the art of record” (id.). We disagree.
Our finding of obviousness logically follows from our finding
that the packaged integrated circuit of claim 1 is described by
Lee and appellants’ acknowledgment that flip-chip mounting of
integrated circuits having I/O pads was know at the time of the
filing of the present application. As noted by the examiner, the
thrust of the invention disclosed in appellants’ specification is
replacing the prior art epoxy adhesive with the claimed barrier
and metallic layers for bonding a heat sink to the back surface
of the die. Our same rationale applies to claim 8 insofar as
appellants have not presented a substantive argument specific to
claim 8, but submit that “claim 8 is patentable over the art of
record for all the reasons set forth above with respect to claims
1 and 2" (page 11 of principal brief, second paragraph).
Concerning claim 9, which defines a semiconductor wafer
comprising a plurality of dice with the metallic and barrier
layers deposited on the second surface of the wafer, we agree
with the examiner that it would have been obvious for one of
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