Ex Parte Nakada et al - Page 3




          Appeal No. 2004-0375                                                        
          Application 09/841,926                                                      


               Takagi discloses a developing roller having a highly                   
          conductive shaft (2) and, around the outer periphery of the                 
          shaft, an elastic layer (3) (col. 3, lines 57-62).  The elastic             
          layer is covered, optionally over its entire surface, with a high           
          resistivity surface layer which can be a urea resin or a melamine           
          resin (col. 6, lines 34-41; col. 8, lines 9-11).  Urea resin and            
          melamine resin are among Takagi’s preferred surface layer                   
          materials (col. 6, lines 47-48).  In an example, a melamine resin           
          is mixed with an oil free alkyd resin in a 1:4 ratio (col. 10,              
          lines 54-57).  There is no dispute as to whether the oil free               
          alkyd resin is a crosslinking component.  The disclosed elastic             
          layer materials include silicon rubber (col. 4, lines 11-14).               
          For resistivity adjustment, the elastic layer includes 0.01-1               
          parts by weight of an ionically conductive material and can                 
          include a suitable amount of an electronically conductive                   
          material (col. 5, lines 11-55).  The disclosed electronically               
          conductive materials include carbon black (col. 5, lines 55-56).            
               Takagi does not disclose a coupling layer between the                  
          elastic layer and the high resistivity surface layer.  Ishii,               
          however, teaches that a coupling layer between a carbon black-              
          containing silicone rubber layer and a polyurethane outer layer             
          of a semiconductive roller improves the adhesion between the                

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