Appeal No. 2004-1834
Application No. 10/158,885
Specifically, appellant argues that Balamurugan allows the local fab to find the
dies to be picked using a wafer map “without the many steps” of Balamurugan “to
determine using a whole wafer map where the locator die is” (reply brief-page 4). The
language of claim 1 relied on is “identifying a pseudo reference die for each partial
wafer not having a reference die which die is the first die in the bottom right.” Appellant
contends that in the reference the auxiliary reference die row is always in the reference
die row (column 5, lines 36-37), which requires information on where the reference die
is. Thus, according to appellant, in Balamurugan, if there is no reference die and the
location of the reference die is not known, Balamurugan’s method cannot determine
where the auxiliary die is located. The present invention does not have to know where
the reference die is located because it uses the pseudo reference die which is the first
die on the bottom right or the next die column number after the last column number of
the previous partial wafer.
Notwithstanding arguments that may be directed to the instant disclosed
invention, Appellant is arguing the claim 1 language, “identifying a pseudo reference die
for each partial wafer not having a reference die which die is the first die in the bottom
right.” But Balamurugan clearly states that a “reference die is located in the first partial
wafer P1 and an auxiliary reference die is located in other partial wafers P2 to P5 in the
lower right corner on the same row as the reference die” (column 4, lines
7
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