Appeal No. 2005-0486
Application No. 09/887,836
Appellant argues that Omura does not teach that the
adhesive resin is cured solventlessly; does not teach that
the adhesive resin is selected from the group recited in
claim 11; and does not teach that the adhesive material is
applied from 0.00005 to 0.001 dry pounds per square foot of
a substrate. Reply Brief, page 6.
The examiner’s response regarding the issue of a
“solventless cured” adhesive resin is set forth on page 12
of the Answer. The examiner states that claim 11 is a
product claim, and that therefore the manner in which the
adhesive is applied is not relevant. The examiner explains
that the adhesive of the final product of Satoh is
solventless. In paragraph 15 of the Office Action of Paper
9, the examiner states that the coating solution in Satoh
is applied to a thermoplastic substrate, and dried, and it
returns to the carboxylic anhydride group due to
dehydration. See column 8, lines 7-9, of Satoh. The
examiner states that this teaching shows that the
cured/dried adhesive resin is solventless.
We believe the examiner’s reasoning does not address
the requirement of claim 11 that the solventless cured
adhesive resin is applied from 0.00005 to 0.001 dry pounds
per square foot of a substrate.2 That is, in its already
solventless cured state, the adhesive resin is applied from
0.00005 to 0.001 dry pounds per square foot of the
2 This aspect of the claimed invention is described on page 4 of
appellant’s specification.
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