Appeal No. 2005-2530
Application No. 10/612,129
non-conductive adhesive layer 142 (col. 4, lines 55-59).
Lupinski, on the other hand relates to using a plasticized
polymer useful as a low temperature laminating adhesive for
circuit manufacturing (abstract, col. 1, lines 6-8). As depicted
in the Figure, Lupinski laminates an overlay dielectric layer 50
to substrate 10 having IC chip 30 attached thereon using a
plasticized polyetherimide composition 40 in order to provide
void free adhesive bonding at low temperature (col. 2, lines 9-
18).
Based on our findings above, we disagree with Appellants’
arguments and conclusion that the combination is improper since
the substrate disclosed by Lupinski has no relationship to
contact pads. Both references are concerned with using an
adhesive for attaching an insulating substrate to the active
surface of a semiconductor chip. Specifically, as argued by the
Examiner (answer, page 8), the polymeric adhesive disclosed by
Lupinski provides void free adhesive bonding in a low temperature
process.
We also remain unconvinced by Appellants’ argument that
Lupinski needs to show that insulating layer 50 includes
conductive strips and contact pads on the surface to be bonded
with the active surface of an integrated circuit chip for a
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