Ex Parte Lee et al - Page 9


          Appeal No. 2005-2284                                                        
          Application No. 09/748,589                                                  
          and increases chip size, which is often undesirable in high-density         
          memories that try to maximize the ratio of number of memory                 
          cells/chip size.”  Appellants conclude that the skilled artisan             
          “would have followed conventional wisdom and not have added ECC             
          circuitry to the memory arrays disclosed in Zhang and Johnson.”             

               We disagree.  As rightly pointed out by the examiner in                
          response (answer-page 8), any such alleged disadvantages “were              
          obviously not enough to prevent Leedy from incorporating it for             
          their [sic, his] three dimensional high-density memory to achieve           
          the well known aforementioned benefit of error correction                   
          capabilities.”  Thus, since Leedy appears to do what appellants             
          assert the skilled artisan would not do (i.e., add ECC circuitry to         
          memory arrays), in order to prevail, appellants would need to point         
          to additional evidence as to why the artisan would not have taken           
          the teachings of Leedy and applied them to the memory arrays of             
          Zhang and/or Johnson.                                                       

               As for appellants’ “teaching away” argument, a reference may           
          be said to “teach away” when a person of ordinary skill, upon               
          [examining] the reference, would be discouraged from following the          
          path set out in the reference or would be led in a direction                
          divergent from the path that was taken by the applicant.  In re             
          Gurley, 27 F.3d 551, 553, 31 USPQ2d 1130, 1131 (Fed. Cir. 1994).            
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