Appeal No. 2006-0977
Application 10/250,605
Igarashi et al. (Igarashi)
(Japanese Patent Abstract) 05-067702 Mar. 19, 1993
Yamaguchi et al. (Yamaguchi)
(Japanese Patent Abstract) 06-145306 May 24, 1994
Fujii et al. (Fujii)
(Japanese Patent Abstract) 11-269349 Oct. 5, 1999
Appellants’ claimed invention is directed to an epoxy resin
composition that finds utility in semiconductor encapsulation. The
composition comprises a biphenol epoxy resin of the recited formula,
a thiodiphenol compound of the claimed formula (II), a polyhydric
phenol, an inorganic filler and a curing accelerator.
Appealed claims 1, 3-5, and 7-9 stand rejected under 35 U.S.C.
§ 103(a) as being unpatentable over Japanese ‘306 in view of
Japanese ‘349. Claims 1, 3-5, and 7-9 also stand rejected under
35 U.S.C. § 103(a) as being unpatentable over Japanese ‘349 in view
of Japanese ‘702 and Japanese ‘306.
Appellants admit at page 3 of the brief that “[t]he claims 1,
3-5, and 7-9 stand or fall together.” Accordingly, all the appealed
claims stand or fall together with claim 1.
We have thoroughly reviewed each of appellants’ arguments for
patentability. However, we are in complete agreement with the
examiner’s reasoned analysis and application of the prior art, as
well as his cogent and thorough disposition of the arguments raised
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