Ex Parte Raaijmakers et al - Page 9




              Appeal No. 2006-1333                                                                                      
              Application No. 10/347,849                                                                                

                     In view of the above discussion, since all of the claimed limitations are present in               
              the disclosure of Venkatesan, the Examiner’s 35 U.S.C. § 102(e) rejection of independent                  
              claim 24, as well as dependent claim 25 not separately argued by Appellants, is sustained.                
                     We also sustain the Examiner’s 35 U.S.C. § 103(a) rejection of dependent claims                    
              26-32 in which the Examiner has added Sato to Venkatesan to address the particular                        
              deposition process parameter features of those claims.  We find no error in the Examiner’s                
              line of reasoning as set forth at pages 5 and 6 of the Answer.  Further, Appellants have                  
              made no separate arguments for patentability with respect to these claims and have                        
              instead chosen (Brief, page 4) to let these claims stand or fall with independent claim 24.               







                     Lastly, we make the observation that, although the Examiner has made a 35 U.S.C.                   
              § 102 anticipation rejection of independent claim 24, it is apparent from our reading of                  
              Venkatesan that a 35 U.S.C. § 103 obviousness rejection could also have been made.                        
              Venkatesan, in recognition of the often competing characteristics of high deposition rates                
              and good step coverage in silicon deposition processes, particularly as related to high                   
              aspect ratio openings, describes an invention which is directed to the optimization of the                
              deposition process parameters.  As stated at column 2, lines 41-44 of Venkatesan, “[t]he                  
              process of the present invention can be used to form an amorphous silicon and polysilicon                 
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