Appeal 2007-0236
Application 09/934,474
and the mist of pure water supplied from said supply unit third supply unit
[sic] to form a polishing mixture, said mixing unit supplying the polishing
mixture onto said major surface of said polishing table.
2. An apparatus including a polishing solution supply system, the
polishing solution supply system comprising:
a polishing table for placing a semiconductor substrate on a major
surface thereof;
a first supply unit for spraying and supplying a mist comprising
abrasive slurry to a specified location on said major surface of said polishing
table;
a second supply unit for spraying and supplying a mist comprising
additive onto said major surface of said polishing table so as to mix with the
mist of abrasive slurry supplied from said first supply unit; and
a third supply unit for spraying and supplying a mist comprising pure
water onto said major surface of said polishing table so as to mix with the
mist of abrasive slurry supplied from said first supply unit and with the mist
of additive supplied from said second supply unit.
The references set forth below are relied upon by the Examiner as
evidence of obviousness:
Murphy US 5,478,435 Dec. 26, 1995
Chamberlin US 5,997,392 Dec. 7, 1999
Claims 1-19 are rejected under 35 U.S.C. § 103(a) as being
unpatentable over Murphy in view of Chamberlin.1
1 The Appellants have separately grouped the appealed claims in the manner
indicated on page 4 of the Brief whereby the apparatus and method claims
representing the Figure 8 embodiment are grouped and argued separately
3
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