Appeal 2007-1055
Application 10/831,012
transmission lines separated from the substrate by at least one of the
dielectric layers such that the first array is electrically isolated from the
substrate;
embedding a thermally conductive element in the one or more dielectric
layers at a location of the heterostructure where a heat transfer path can be
established in response to a thermal gradient generally directed from the first
array to the thermally conductive layer,
wherein adjacent transmission lines of the first array are separated from each
other by a distance ranging from approximately 25 to approximately 250
microns, and wherein the thermally conductive element has an out-of-plane
thickness ranging from approximately 0.1 to approximately 1 microns.
The Examiner relies upon the following references as evidence of
obviousness:
Fathy US 6,154,176 Nov. 28, 2000
Gotro US 2002/0162685 A1 Nov. 7, 2002
Swanson US 6,580,170 B2 Jun. 17, 2003
Appellants’ claimed invention is directed to a method for fabricating a
micro-scale device having internal heat spreading capability. The method
entails separating a first array of electrical transmission lines from a
substrate with a dielectric layer and embedding a thermally conductive
element in one of the dielectric layers. Adjacent transmission lines of the
array are separated from each other by a distance ranging from about 25 to
about 250 microns, and the thickness of the thermally conductive element is
approximately 0.1 to approximately 1 micron.
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