Appeal 2007-1772
Application 10/672,750
a substrate coupled to one of the at least two semiconductor die
by a second adhesive, the second adhesive being curable
at a second temperature lower than the first temperature;
wherein each die in the stack of at least two die is successively
thinner than the previous die.
70. An integrate circuit package comprising:
a substrate; and
a die stack coupled to the substrate, wherein the die stack
comprises at least two semiconductor die coupled together and
wherein the die stack is formed prior to being coupled to the substrate;
wherein each die in the stack is successively thinner than the
previous die.
The Examiner relies on the following prior art references as evidence
in rejecting the appealed claims:
Pai US 6,503,776 B2 Jan. 7, 2003
Hakey US 6,627,477 B1 Sep. 30, 2003
Huang US 6,753,206 B2 Jun. 22, 2004
Claims 35, 37-39, 45, 47-49, 63, and 65-67 stand rejected under
35 U.S.C. § 103(a) as being unpatentable over Pai in view of Huang. Claims
68-70 stand rejected under 35 U.S.C. § 103(a) as being unpatentable over
Pai in view of Hakey.
We affirm the Examiner’s rejection of claims 45, 47-49, 63, 65-67, 69
and 70. We reverse the Examiner’s rejection of claims 35, 37-39, and 68.
Our reasoning follows:
Rejection over Pai in view of Huang
Claims 45, 47-49, 63, and 65-67
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